vIn recent years, the demand for computing power, driven by generative AI, large-scale model training, and inference, has grown exponentially, propelling global data center construction into a new cycle. Compared to traditional servers, AI servers have power density increases several times, even ten times, making traditional air cooling insufficient for heat dissipation needs. Liquid cooling is gradually becoming an essential option for high-density computing power.
As a crucial step in product factory testing and project acceptance, Emax liquid-cooled load banks can be deeply customized to meet customer needs.
The industry generally believes that future competition in data centers will not only be about chips and power, but also about heat dissipation and infrastructure capabilities. Liquid cooling technology can remove heat directly at the chip level, significantly improving energy efficiency and supporting higher rack power density, thus becoming a key component of AI infrastructure. Against this backdrop, global cloud vendors, hyperscale data centers, and hosting service providers are accelerating the deployment of liquid-cooled architectures, driving rapid growth in demand for CDUs, cold plates, and liquid cooling systems.
Eaton's acquired subsidiary, Boyd, announced the formal expansion of its liquid cooling manufacturing facility in Juarez, Mexico, further strengthening its position in the next-generation data center liquid cooling field. According to the company's disclosure, Boyd is expanding its design and manufacturing capabilities at its Juarez thermal management campus in Mexico to match the explosive growth in global AI data center demand. Following this expansion, the facility's area will increase from approximately 217,000 square feet to approximately 460,000 square feet, representing a significant leap in manufacturing capacity.
After the expansion, the factory will focus on producing coolant distribution units (CDUs), direct-to-chip cold plates, liquid cooling loops, and rack-mount liquid cooling manifolds. Currently, Boyd's CDU products support cooling capacities from 0.5MW to 5MW and continue to evolve towards higher power densities to adapt to future AI server architectures.
“We anticipate the needs and market dynamics of AI data center customers, and continuously adjust our operations, manufacturing capabilities, and technology investments to meet cooling demands of up to 5 MW and above,” said David Huang, President of Boyd's Thermal Solutions Business Unit. “Global customers rely on the Boyd Juarez factory for scalability, high performance, and flexibility when building current and future data center infrastructure.”
CoolIT, a leading Canadian data center liquid cooling manufacturer, shared details of its newly expanded data center liquid cooling production facility—the Tarfield factory. The Tarfield plant is one of CooliT's three global manufacturing sites, capable of producing thousands of CDUs, cold plate circuits, and rack manifolds annually. CooliT has recently introduced new production lines, advanced self-verification protocols, and enhanced quality control directly compliant with NVIDIA standards. CDU shipments are projected to reach 2,600-3,000 units by 2026.
