This rack-level liquid-cooled load bank is engineered to simulate the latest AI liquid-cooled servers. It adopts the identical cold plate liquid cooling solution deployed on physical production servers, delivering an effective thermal power efficiency of over 95%.
Designed on a modular architecture, each individual power module has a rated capacity of 20kW, with a thermal response time within 30 seconds to achieve a stable output P-Thermal.
It is fitted with 63A Ceeform electrical connectors complying with IEC60309 standards, while FD83 quick couplings serve as the liquid circuit connections. The unit is built to a 1:1 scale replication of standard server racks.
Every liquid module features UQD connectors that support hot swapping without system shutdown. An integrated fluid manifold is equipped to the whole Rack, keeping flow deviation across all branches below 3%.
- Working Cycle: Continuous operation.
- Ambient temperature: -10℃~50℃
- Liquid direction: Bottom feed or Top feed, right inlet/left outlet
- Heat transfer fluid: 25% Propylene Glycol/Pure water
- Operating environment humidity: 0～95%
- Dimensions: Height 33U
- Instrumentation: Digital metering (V, A, kW) and data logging.
- Control Power: Via external 400V AC / Testing circuit.
- Inlet water temperature: 5-40℃
- Delta temperature < 12ºC
- Heating Elements: Cold-Plated
- Safety Features: Over-temperature, over/under voltage, over/under pressure, and current imbalance protection.
- Load Connections: 5-core CEE form IEC60309 Plug or Camlock
- Daisy Chained: Multiple load banks can be hooked together for higher load capacity.
- Enclosure: Heavy-gauge steel indoor enclosure with powder-coat finish. Hinged access doors with lockable latches. Forklift pockets for easy mobility.
